Exhibitor Seminars
ETSE11
Interpreter
TechSPOT Exhibitor Seminars, East Hall 4, TOKYO BIG SIGHT
15:00-15:50 Thu., 13-Dec
EVG's Latest Bonding Technoligies for 'Heterogeneous Integration'
Sponsored by
Session Description
Since the end of Moore's Law is seriously discussed, Heterogeneous Integration without relying on miniaturization only is being more important. In this seminar, EVG's latest bonding technologies which realize heterogeneous integration will be presented.
Program Agenda
EVGroup Japan K.K.