Exhibitor Seminars
ETSE12
Interpreter
TechSPOT Exhibitor Seminars, East Hall 4, TOKYO BIG SIGHT
Thu., 14-Dec
Latest Wafer Bonding Technologies - A Game Changer for IoT and AI
Sponsored by
Session Description
Wafer bonding is a key technology to realize the next generation devices enabling higher performance with lower power consumption for IoT and AI. EVG has No.1 market share in this field.
We are going to introduce the latest wafer bonding technologies and future prospects.
Program Agenda
EVGroup Japan K.K.