Exhibitor Seminars
ETSW02
Interpreter
TechSPOT WEST, East Hall 1, TOKYO BIG SIGHT
Wed., 13-Dec
Linear Transport PVD System for Barrier/Seed Layers in Fan-Out Packaging
Sponsored by
Session Description
We present PVD results from a linear transport system for barrier/seed layers for 300mm FOWLP and 600mm square FOPLP. We also present analysis of linear transport system throughput and Cost of Ownership (CoO) calculations as compared to a typical PVD cluster tool used for Fan-Out RDL.
Program Agenda
Intevac Inc.