Exhibitor Seminars
TSS1
Interpreter
TechSTAGE SOUTH, East Hall 1, TOKYO BIG SIGHT
10:20-12:00 Wed., 13-Dec
Heterogeneous Integration Roadmap
Sponsored by
Session Description
With the completion of the ITRS, the IEEE CPMT Society, the Electron Device Society, the Photonics Society, the ASME EPPD Division, and SEMI now presents the "Heterogeneous Integration Roadmap". The session introduces its latest developments.
Program Agenda
10:20-10:23
Tom Salmon
VP, Collaborative Technology Platforms, SEMI
10:23-10:43
Heterogeneous Integration Roadmap - Global Collaboration
William Chen
Co-Chair
Heterogeneous Integration Roadmap, IEEE Electronic Packaging Society
The electronic industry has reinvented itself through multiple disruptive changes in market, business, and technologies. We are now entering a new era of digital economy with data migration to the cloud, smart devices everywhere, Internet of Things to Internet of Everything, and the emergence of autonomous vehicles. While Moore’s Law is slowing, the pace of technology innovation continues to expand to meet challenges of the new era. The crucial question is: how do we re-invent the Technology Roadmap and chart the critical paths going forward?
The IEEE Electronic Packaging Society (EPS), Electron Devices Society (EDS), and Photonics Societies, ASME EPPD and SEMI have joined in collaboration to re-invent the Technology Roadmap for the professional, industry, academia and research communities. The Heterogeneous Integration Roadmap (HIR) will follow directly the purpose, process and format of the ITRS for the 15-year assessment of future requirement, and 25-year assessment for emerging materials and emerging devices. The roadmap will address disruptive changes in the market place, major challenges in technology requirements, while identifying roadblocks and potential solutions. The goal is to stimulate research to address the roadblocks and to realize the potential solutions.
This talk will report on the disruptive market landscape, examples of heterogeneous integration innovations, followed by the global roadmap collaboration in the making of the Heterogeneous Integration Roadmap. We shall introduce the work of the Technical Working Groups in achieving the purpose to provide long term vision into the future and identifying the needs of future system applications.
10:43-11:03
HETEROGENEOUS INTEGRATION - A Key To Our Future
Bill Bottoms
Co-Chair
Heterogeneous Integration Roadmap, IEEE Electronic Packaging Society
The electronics industry has maintained the rate of progress predicted by Moore’s Law since his observation was published in 1965. The primary driver was scaling of CMOS. It was the “low hanging fruit” providing the lowest cost to maintain progress. The future benefits of scaling cannot support that rate of progress and new technology is needed. The major limitations for the electronics industry going forward will be performance, power requirement, bandwidth and cost.
Heterogeneous Integration (HI) is the technology that fills the need and it will be the major contributor to progress for the next 3 decades or more. It enables significant improvement for all four of these limiting factors. The key elements of HI technology are 3D system integration, heterogeneous integration by materials and component types, system integration in the package (SiP) and interconnecting packages and components by photonics. This enables more complex systems including the global data network. The elements of innovation for HI that will be discussed include:
• New materials
• New device types
• New production processes
• New system and network architectures
These elements enable improvement in cost, power, latency and performance. A key to making the rapid and cost effective progress required will be pre-competitive collaboration among industry, academia and government. This collaboration, addressing the difficult challenges that must be met to maintain the rate of progress, will be discussed
11:03-11:45
HIR Technical Working Group Panel Sessions
Bill Bottoms
William Chen
Co-Chair
Heterogeneous Integration Roadmap, IEEE Electronic Packaging Society
David Armstrong
Director
Business Development
Advantest America, Inc.
Rozalia Beica
Global Director Strategic Marketing and New Business Development
The Dow Chemical, Electronics & Imaging Division
The Dow Chemical Company
Yasumitsu Orii
General Manager
New Value Creation Office
NAGASE & Co., LTD.
Tom Salmon
VP, Collaborative Technology Platforms, SEMI
11:45-12:00
Wrap-Up