Exhibitor Seminars
ETSW03
Interpreter
TechSPOT WEST, East Hall 1, TOKYO BIG SIGHT
Wed., 14-Dec
CONNECTEC JAPAN
Our challenge to IoT assembly and manufacturing revolution by MontserPAC technology.
Sponsored by
Session Description
With the explosion in the number of IoT and wearable devices, semiconductor packaging technology will be forced to correspond to high-mix, low-volume type of products, including MEMS, sensors and so on.
In order to deal with this situation, we will propose low-temperature damage-free bonding technology using bumps with conductive paste.
Program Agenda