Exhibitor Seminars
ETSE12
Interpreter
TechSPOT Exhibitor Seminars, East Hall 4, TOKYO BIG SIGHT
Thu., 15-Dec
Otsuka Electronics Co., Ltd.
Non-contacting meas. tech. for electronic device in-process Intro. of evaluation method of thickness
Sponsored by
Session Description
The SF3 series offers high-speed thickness monitor and wafer TTV measurement in the process of CMP, with a high degree of accuracy.
The OPTM series adapts the latest technology to realize further high-speed and high-precision measurement.
We will propose the improvement of product yield to you.
Program Agenda