Exhibitor Seminars
ETSE06
Interpreter
TechSPOT Exhibitor Seminars, East Hall 4, TOKYO BIG SIGHT
Wed., 14-Dec
Silicon Saxony e.V.
“Leading edge technologies from Silicon Saxony, Germany ”
Sponsored by
Session Description
bubbles&beyond: “gentle, waterbased cleaning and resist removal technology update and process implementation”
Fraunhofer IZM-ASSID:
“Heterogeneous integration of multiple electronic devices is a key enabling technology which covers wafer level e.g. CSP, 3D, 2.5 integration as well as board level approaches.”
Program Agenda