Exhibitor Seminars
TSI2
Interpreter
TechSTAGE INNOVATION & IoT, East Hall 3, TOKYO BIG SIGHT
12:50-14:30 Wed., 14-Dec
STS MEMS/Sensor Session(2)
Heterogeneous-Integration in MEMS
Sponsored by
Session Description
Microsystems integrating a variety of different devices and elements, such as semiconductor electronic circuit devices and MEMS devices, are expected to bring about a qualitative transformation in semiconductor devices, in a process known as heterogeneous integration. This session will explore the potential of heterogeneous integration through presentations on markets, application technologies and elemental technologies.
Program Agenda
Masayoshi Esashi, Tohoku University
Sumio Horiike, Omron
12:50-13:20
MEMS & Sensors Technology and Market Trends
Jean-Christophe Eloy
President & CEO
Yole Developpement
After almost 10 years of growth linked to the use of MEMS devices in mobile phones and automotive applications, MEMS is finding new growth opportunities in all the new applications that are driving the growth of the electronic industry: autonomous vehicles and new medical devices including mobile healthcare, wearable systems, IoT… are using MEMS devices to provide key functions. But one of the challenge is that the prices are going down, almost as fast as the growth in unit. In such challenging environment, what are the applications to target and the key technical and manufacturing trends in order to further the development the MEMS industry ? The presentation will both analyse the market trends and the changes in the manufacturing and development infrastructure in order to be able to answer to the main challenges of the MEMS industry.
13:20-13:50
Latest prospects of chip-scale atomic clocks
Shigeyoshi Goka
Graduate School of Engineering
Associate Professor
Tokyo Metropolitan University
This talk is a servey for latest prospects of chip-scale atomic clocks (CSACs). Since the CSACs don't need an external microwave cavity to excite the coherent popuration trapping (CPT) resonances, the CSACs with low-power consumption can be fabricated in a small volume. In this talk, present problems and required improvements for next-generation CSACs, and recent research topics are introduced.
13:50-14:20
Wafer-level heterogeneous integration using metal bonding based technology
Hideki Hirano
Assistant professor
Micro system integration center
Tohoku University
Wafer-level integration with dissimilar components such as CMOS-LSI and microelectromechanical systems (MEMS) into single systems enables diversification and high-performance of microelectronics. Monolithic integration of heterogeneous components using wafer-to-wafer bonding based technologies is considered as a promising approach in terms of potential in optimizing each wafer fabrication process and hermetic device packaging at the same time. Above all, intermediate layer bonding technique using metal as the interlayer material is advantageous for electrical interconnecting, stronger bonding strength and higher vacuum sealing for advanced heterogeneous integrated devices, such as intelligent sensors. Application examples of vacuum packaging and integration using metal bonding technologies which are applicable to non-planer and temperature-sensitive wafers will be given.