Exhibitor Seminars
TSN3
Interpreter
TechSTAGE NORTH, East Hall 5, TOKYO BIG SIGHT
15:10-16:50 Wed., 14-Dec
CGMG Forum
Chemicals & Gases
Sponsored by
Session Description
This forum will look at the materials requirements for high-volume semiconductor manufacturing at 10, 7, and 5 nm. In particular, speakers will review device makers’ expectations and requirements of new materials and process gases, and review government support for the materials industry. The global trends towards new technology development will be also introduced at this forum.
Program Agenda
15:10-15:20
Introduction to Forum
Hiromichi Enami
Corporate Adviser
Process Equipment Business Strategy, Electronic Device Systems Business Group
Hitachi High-Technologies Corporation
15:20-15:50
NEDO’s Support and Outlook for Materials Development
Masayuki Yoshiki
Director General
Naterials Technology and Nanotechnology Dept.
New Energy and Industrial Technology Development Organization (NEDO)
The New Energy and Industrial Technology Development Organization (NEDO) undertakes technology development activities by integrating the combined efforts of industry, academia, and government. NEDO thus plays an important part in Japan’s industrial policies in response to various technological phases and social needs. In the semiconductor field, NEDO provides a wide range of assistance for the development of cutting-edge miniaturization technology, semiconductor production equipment, and materials. In my presentation, I will describe NEDO’s past activities and the recent shift in national policies. I will also introduce NEDO’s outlook and recent trends for materials development.
15:50-16:20
Expectations and prospects for new materials : From semiconductor device manufacturing viewpoint
Kei Hattori
Assistant to General Manager
Memory Technology Research and Development Center
Toshiba Corporation Storage & Electronic Devices Solutions Company
During the 20th century, by shrinking the pattern size and increasing the Si wafer size, we have responded to requests of market. But, from the beginning of the 21st century, this trend seems to have come to a limit. Although the challenges to shrink the pattern size and increase the Si wafer diameter will be continued, we should have other options. 3-dimensional device has appeared and spread, as one option. In the case of memory devices, the storage method moves from electric charge accumulation to utilizing some kind of change of state. Based on this background, I will talk about the expectations for new materials from the viewpoint of semiconductor device manufacturing, along with introduction of some recent topics.
16:20-16:50
Asia's Impact on the WW Semiconductor Materials Market
Lita Shon Roy
President / CEO
TECHCET / CMCFabs
Korea and Taiwan, combined, dominate semiconductor manufacturing fabrication, but the materials market has been largely dominated by US and Japanese companies A shift in material suppliers' market shares is occurring that is contributing to more mergers and acquisitions, stimulated by the growth of semiconductor manufacturing in Asia and China's 5-year plan to become a semiconductor leader. How fast is this changing? Which countries have the largest growth potential in the materials market space? And which materials offer the best growth opportunities? These questions will be answered in TECHCET's presentation focused on the Semiconductor Materials Market and Supply Chains. Market statistics and forecast will be provided in addition to opportunities and trends in semiconductor materials.