Exhibitor Seminars
ETSE09
Exhibitor Seminar Room A, 2F, West Exhibition Hall, Tokyo Big Sight
13:40-14:30 Fri., 13-Dec
Future of Sensing devices realized by OSRDA service, The Core is low temperature assembly tech.
Sponsored by
Session Description
Introduction of our solution & service provide business, this is up to process development, material choice, Assembly process.
Customers strongly required to propose low temp. tech. to us.
The reason is increase of Substrate Materials and heat fragile Devices in IoT, and Wearable field.
Program Agenda
Connectec Japan