SEMICON JAPAN 2018

2018年12月12日-14日

東京ビッグサイト

申込者情報・アンケート

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申し込みタイトル
受付終了  

exhi-01

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*印の項目は入力必須項目です。必ずご記入ください。

  • Name of inviter
  • Recipient email address of Badge
  • Name
    First Name
     Last Name
  • Title
    Mr. Ms. Mrs. Dr. Prof.
  • Company Name
    If there is no company name, please fill out "NA".
  • Division/Department
    If there is no division/department, please fill out "NA".
  • Position/Function
    If there is no position/function, please fill out "NA".
  • Country/Region
  • Postal Code
  • City, State/Province
  • Address 1(Street)
  • Address 2(Bldg.)
  • Phone
    e.g. +81(Country Code)-3(Area Code)-1234-5678
    Please start with your country code.
  • Fax
    e.g. +81(Country Code)-3(Area Code)-1234-5678
  • E-Mail
  • Confirm E-mail
    Enter again for confirmation.
  • Permission for Direct Mail
    Accept Do Not Accept
  • Preferred Language (information from the secretariat)
    Japanese English
  • Login Password
  • Confirm Login Password
  • Please indicate your level of management or supervisory responsibilities (select one)
    B1:Executive Management (Chairman, CEO, CFO, CMO, President, Chief, Managing Director)B4:Non-Management (Staff, Professional, etc.)
    B2:Senior Management (Vice President, Director)B5:Student
    B3:Other Management (Program Manager, Manager)B0:Other job level
  • Please indicate your primary job function (select one)
    P1:DesignP13:Facilities/Engineering Support
    P2:R&DP14:Logistics/Supply Chain Management
    P3:Product ManagementP15:Integration/IT Support
    P4:Fabrication and Process EngineeringP16:Purchasing/Procurement/Office Management
    P5:Equipment EngineeringP17:Executive Management/Board Member
    P6:Industrial EngineeringP18:Marketing, Sales, Business Development
    P7:Software EngineeringP19:Environment, Health & Safety (EHS)
    P8:Chemicals/MaterialsP20:Government/Public Policy
    P9:TestP21:Human Resources
    P10:Packaging/AssemblyP22:Financial/Industry Analyst/Investor Relations
    P11:Quality Assurance/Failure Analysis/ReliabilityP23:Training/Education
    P12:Manufacturing/Operations Management/ProductionP0:Other Job function
  • In which industries do you work or serve? (select all that apply)
    M1:SemiconductorM13:PCB Assembly
    M2:MEMSM14:EMS/Contract Manufacturing/Precision Engineering
    M3:SensorsM15:Automotive/Transportation
    M4:ImagingM16:Medical
    M5:Flexible Hybrid Electronics/Printed ElectronicsM17:Aerospace
    M6:LED/Solid State LightingM18:Professional Services/Consulting
    M7:PhotonicsM19:Academia/University/R&D
    M8:Display/FPDM20:Media/Publication
    M9:Photovoltaic/SolarM21:Association/Non-profit
    M10:Software/ApplicationsM22:Government
    M11:Consumer ElectronicsM0:Other
    M12:PCB Manufacturing
  • Visitors division
  • Please indicate your visitor category for printing on the visitor badge
    Device ManufacturingNon Manufacturing Services or Consulting
    Semiconductor Equipment and Materials ManufacturingConsumer Electronics,Electronic Machines
    Software, Manufacturing Services of ConsultingStudent, Professor, Teacher
  • Will you visit?
    SEMICON Japan only
    SMART Applications Zone only
    Both
  • In which manufacturing technologies are you interested? (if applicable; select all that apply)
    N1:Design/EDA/IPN6:Material Engineering/Materials Science
    N2:Front-end Manufacturing (IDM, Foundry)N7:System-level manufacturing
    N3:TestN8:Board-level manufacturing
    N4:Packaging/AssemblyN9:System Integration
    N5:Roll-to-Roll/PrintingN0:Other Manufacturing
  • Please select the products, services, and technologies in which you are interested (select all that apply)
    Q1:Design/EDA Q2:Fabless Q3:Foundries Q4:Packaging & Test Services (OSAT) Q5:Electronic Manufacturing Services (EMS)/System Integration Q6:Factory Control/Process Software Q7:Manufacturing Services and Consulting Q8:Engineering Service Q9:R&D/Technology Transfer Q0:Other R1:Front-end Processing R2:Printing/Coating/Roll-to-Roll R3:Large-area/Thin Film R4:Inspection & Measurement/Metrology R5:Test R6:Assembly/Packaging R7:Factory Automation: Robotics R8:Abatement/Environmental Systems R9:Components/Sub-systems/Instrumentation R10:Parts R11:Secondary Equipment and Services R0:Other S1:Wafers/Substrates S2:Process materials: Gases/Liquids/Solids/Chemicals S3:Inks/Pastes/Printing Materials S4:Cleaning S5:Packaging/Assembly S6:Consumables S0:Other T1:Support Products/Cleanroom T2:General Business Services/Consulting T3:Representative Sales and Service T4:Standards T0:Other
  • Please indicate the applications in which you are interested (select all that apply)
    U1:Smart ManufacturingU8:Mobile Technologies/Wireless/5G
    U2:Virtual Reality/Augmented Reality (VR/AR)U9:Consumer Electronics
    U3:Artificial Intelligence Systems (AI)U10:OLED
    U4:Automotive Electronics/Smart TransportationU11:Green Manufacturing/EHS
    U5:Internet of Things (IoT)U12:Cloud Computing/High-Performance Computing
    U6:WearablesU13:Imaging
    U7:Medical Electronics/MedTechU0:Other applications
  • Please indicate your company size
    1 - 99 Employees200 - 499 Employees1,000 - 9,999 Employees
    100 - 199 Employees500 - 999 Employees>10,000 Employees
  • Please indicate your level of purchasing authorization
    Final Decision Maker/Co-Deciding/CrucialSpecify
    Recommend/Evaluate /ConsultNo Role
  • VIP
    VIP
  • VIP attribute
  • 出展者フラグ
    出展者
  • 当日登録
    当日
  • Please indicate your age range
    10-1930-3950-5970+
    20-2940-4960-69
  • Are you interested in exhibiting in the future?
    Please send me more information about exhibiting.
  • Do you agree with our privacy policy to receive further information ?
    Yes, I agree.
  • 個人情報の取扱い
    Privacy policy
    SEMI is committed to respecting your privacy, and recognizes your need for appropriate protection
    and management of personally identifiable information you share (any information by which you can
    be identified, such as name, address, and telephone number). For this reason, SEMI has established
    this privacy policy, so that you can understand how we carefully treat your information.
    We automatically collect the following information about your use of our Services through cookies, web beacons, and other technologies, including tracking technologies designed for mobile devices: your domain name; your browser type and operating system; web pages you view; links you click; your IP address; the length of time you visit our Site and/or use our Services; and the referring URL, or the webpage that led you to our Site.
    We may combine this information with other information that we have collected about you, including, where applicable, your user name, name, and other personal information.