Exhibitor Seminars
ETSI07
Interpreter
TechSPOT INNOVATION and IOT, East Hall 3, TOKYO BIG SIGHT
Thu., 14-Dec
Innovation of Joining Technology with IMS (Injection Molded Solder) for IoT and AI Era
Sponsored by
Session Description
Advanced joining technologies such as ultra-fine pitch joining and 3D interconnection supposed to be required for IoT sensor modules, and AI modules which process big data from the sensors. IMS is an innovative technology that enables advanced joining applications with low cost and green process.
Program Agenda
IBM Research – Tokyo